Epoxy resin composition, surface treating method, ink-jet...

Etching a substrate: processes – Forming or treating thermal ink jet article

Reexamination Certificate

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C427S272000, C427S468000, C427S487000, C427S489000, C427S490000, C427S496000, C427S503000, C526S204000, C526S217000, C526S242000, C526S245000, C526S266000, C526S268000, C526S273000, C526S279000, C526S324000, C526S325000, C526S346000

Reexamination Certificate

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06869541

ABSTRACT:
An epoxy resin composition suitable for forming a film of excellent water repellency which comprises an epoxy resin having one or more water repellent groups and two or more cyclic aliphatic epoxy groups per molecule, a triazine-base catalyst for cationic polymerization and a non-polar solvent.

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Handbook of Epoxy Resins, Lee and Neville, 1967,pp. 10-14 through 10-16.

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