Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1991-06-28
1992-07-14
Tolin, Gerald P.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
165 46, 174 17LF, 174 524, 357 82, 361385, 361401, H05K 720
Patent
active
051308894
ABSTRACT:
A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections. In addition, the lower viscosity of the liquid substantially prevents stress on the bond wires. To confine the liquid and prevent void formation, a coating is positioned over the exposed region of the liquid. A cover may be positioned over the cavity to further protect the integrated circuit.
REFERENCES:
patent: 3885304 (1975-05-01), Kaiser
patent: 4054938 (1977-10-01), Morris, Sr.
patent: 4630172 (1986-12-01), Stenerson
patent: 4847731 (1989-07-01), Smolley
patent: 4874915 (1989-10-01), Harms
patent: 5000256 (1991-03-01), Tousignant
patent: 5057909 (1991-10-01), Mok
Gates, et al, "Sealed Chip-on-Board Circuit Protection", p. 198, 41st Electronic Components and Technology Conference, May 11-16, 1991, Atlanta, Ga.
"Parylene Conformal Coatings Specifications and Properties," Nova Tran Corp., 1990.
Fitch John S.
Hamburgen William R.
Digital Equipment Corporation
Tolin Gerald P.
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