Stabilized thermoplastic moulding compounds

Details Stabilized thermoplastic moulding compounds Stabilized thermoplastic moulding compounds

2005-07-19

2005-07-19

Szekely, Peter (Department: 1714)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C100S102000

Reexamination Certificate

active

06919390

ABSTRACT:
Thermoplastic molding compositions comprising, as substantive componentsA) from 29% by weight to 99% by weight of at least one thermoplastic polymer,B) from 1 ppb to 5% by weight of at least one polyethyleneimine homo- or copolymer,C) from 0.05 to 2% by weight of at least one sterically hindered amine compound,and alsoD) from 0 to 70% by weight of other additives,where the percentages by weight of components A) to D) always give 100%.

REFERENCES:
patent: 4360617 (1982-11-01), Muller et al.
patent: 5779954 (1998-07-01), Tinant et al.
patent: 2003/0105199 (2003-06-01), Furukawa et al.
patent: 2003/0195296 (2003-10-01), Dames et al.
patent: 30 11 280 (1981-02-01), None
patent: 36 28 560 (1986-03-01), None
patent: 36 28 561 (1988-03-01), None
patent: 36 28 562 (1988-03-01), None
patent: 19 761 (1980-12-01), None
patent: 52 740 (1982-06-01), None
patent: 855 424 (1998-07-01), None
patent: 02/00780 (2002-01-01), None
patent: 02/00790 (2002-01-01), None
patent: 02/00789 (2003-01-01), None
Pat.Abst.Japan 59191797, Oct. 30, 1984.
Ullmann's Encylo.Ind.Chem., 6thEd 2000 Electronic.
Release, Aziridines, Roark et al., Feb. 2000.

Affiliated with

Also associated with

Rating

Stabilized thermoplastic moulding compounds does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stabilized thermoplastic moulding compounds, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stabilized thermoplastic moulding compounds will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3405519