Epoxy resin compositions, solid state devices encapsulated...

Details Epoxy resin compositions, solid state devices encapsulated... Epoxy resin compositions, solid state devices encapsulated...

2005-07-12

2005-07-12

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C257S791000, C362S800000, C523S451000, C523S456000, C525S474000, C525S533000

Reexamination Certificate

active

06916889

ABSTRACT:
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

REFERENCES:
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patent: 391162 (1990-10-01), None
Polymer Engineering and Science, “The Synthesis and Cationic Polymerization of Novel Epoxide Monomers”, James V. Crivello, vol. 32, No. 20, pp. 1462-1465, 1992.

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