Semiconductor device and method of manufacturing same

Details Semiconductor device and method of manufacturing same Semiconductor device and method of manufacturing same

2005-04-19

2005-04-19

Ngô, Ngân V. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S759000, C257S792000, C257S793000

Reexamination Certificate

active

06882050

ABSTRACT:
A semiconductor device having bump electrodes electrically connected to connection pads formed on a semiconductor chip of the semiconductor device, tips of the bump electrodes exposing at a surface of a sealing resin film formed on a surface of the semiconductor chip, wherein the sealing resin film is comprised of a low-elastic resin layer formed on the surface of the semiconductor chip and a high-elastic resin layer formed on a surface of the low-elastic resin layer and having an elastic coefficient higher than that of the low-elastic resin layer, a thickness of the high-elastic resin layer being between 5 μm and 45 μm.

REFERENCES:
patent: 6605834 (2003-08-01), Lee
patent: 6624504 (2003-09-01), Inoue et al.
patent: 20020030258 (2002-03-01), Fukasawa et al.
patent: 10-079362 (1998-03-01), None
patent: 2000-022052 (2000-01-01), None

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