Semiconductor device package and method of production and...

Details Semiconductor device package and method of production and... Semiconductor device package and method of production and...

2005-07-05

2005-07-05

Nguyen, Tuan H. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S723000, C257S728000, C257S532000

Reexamination Certificate

active

06914322

ABSTRACT:
A semiconductor device including a semiconductor device package providing a capacitor in its circuit board and a semiconductor chip mounted on that package, wherein the capacitor is provided directly under a semiconductor chip mounting surface of the circuit board on which the semiconductor chip is to be mounted and the conductor circuit electrically connecting the semiconductor chip and capacitor is made the shortest distance by having the external connection terminals of the capacitor directly connected to the other surface of the connection pads exposed at one surface at the semiconductor chip mounting surface of the circuit board and to which the electrode terminals of the semiconductor chip are to be directly connected.

REFERENCES:
patent: 6124636 (2000-09-01), Kusamitsu
patent: 6370013 (2002-04-01), Iino et al.
patent: 2002/0070400 (2002-06-01), Shibuya et al.
patent: 2003/0011070 (2003-01-01), Iijima et al.
patent: A-2000-349225 (2000-12-01), None
patent: A-2001-274034 (2001-10-01), None

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