LED device and manufacturing method thereof

Details LED device and manufacturing method thereof LED device and manufacturing method thereof

2005-03-29

2005-03-29

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Having diverse electrical device

C438S026000, C438S111000

Reexamination Certificate

active

06872585

ABSTRACT:
In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.

REFERENCES:
patent: 4925811 (1990-05-01), Menigaux et al.
patent: 5632663 (1997-05-01), Ishihara et al.
patent: 5641611 (1997-06-01), Shieh et al.
patent: 5864206 (1999-01-01), Ishihara et al.
patent: 5949188 (1999-09-01), Leising et al.
patent: 6033926 (2000-03-01), Chakrabarti et al.
patent: 6541130 (2003-04-01), Fukuda et al.
patent: 6552488 (2003-04-01), Roitman et al.
patent: 6563139 (2003-05-01), Hen
patent: 6563263 (2003-05-01), Kawaguchi et al.
patent: 6624491 (2003-09-01), Waitl et al.
patent: 6737735 (2004-05-01), Ito
patent: 6777262 (2004-08-01), Miyaki et al.
patent: 6800996 (2004-10-01), Nagai et al.
patent: 07-129099 (1995-05-01), None
patent: 07-235624 (1995-09-01), None
patent: 09-036434 (1997-02-01), None
patent: 09-139524 (1997-05-01), None
patent: 10-012926 (1998-01-01), None
patent: 10-149767 (1998-02-01), None
patent: 10-200166 (1998-07-01), None
patent: 11-298041 (1999-10-01), None
patent: 2003-78172 (2004-03-01), None

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