Method for cleaning plasma etch chamber structures

Details Method for cleaning plasma etch chamber structures Method for cleaning plasma etch chamber structures

2005-01-11

2005-01-11

Markoff, Alexander (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S001100, C134S030000, C438S905000

Reexamination Certificate

active

06841008

ABSTRACT:
A method for cleaning a plasma reactor clamber part (100) may include dipping the chamber part in a solvent (102) that may dissolve a material that has been redistributed on the chamber part by a reactive plasma. A chamber part may then be rinsed (104), ultrasonically cleaned (106) in a ultrasonic cleaning liquid, and then rinsed again with a liquid that may evaporate at a lower temperature than an ultrasonic cleaning liquid (108). A chamber part may then be blown dry (110) and baked (112). In addition, or alternatively, a method may also include plasma cleaning a chamber part (202).

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