Multi-level integrated circuit for wide-gap substrate bonding

Details Multi-level integrated circuit for wide-gap substrate bonding Multi-level integrated circuit for wide-gap substrate bonding

2005-04-12

2005-04-12

Wille, Douglas (Department: 2814)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S107000, C438S456000

Reexamination Certificate

active

06878638

ABSTRACT:
An integrated circuit includes a substrate having an etched surface and a non-etched surface. The etched surface contains circuit elements and the non-etched surface contains a bonding surface. The non-etched surface is located at a predetermined height from the etched surface. Bonding this integrated circuit with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed.

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