Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-03-15
2005-03-15
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S678000, C257S777000
Reexamination Certificate
active
06867486
ABSTRACT:
A stack chip module includes a substrate having a predetermined-size groove on one side and a circuit pattern, one end of the circuit pattern being adjacent to the groove; a first semiconductor chip adhered in the groove of the substrate by adhesive and having a plurality of center pads and a plurality of edge pads, electrically connected to each other, on the upper part thereof; a plurality of gold wires for electrically connecting the circuit pattern of the substrate and the edge pads of the first semiconductor chip, respectively; a second semiconductor chip having a plurality of center pads corresponding to those of the first semiconductor chip, the formative side being opposite to that of the first semiconductor chip; and a plurality of bumps interposed between the center pads of the first semiconductor chip and the center pads of the second semiconductor chip for joining and electrically connecting them.
REFERENCES:
patent: 5566051 (1996-10-01), Burns
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5939779 (1999-08-01), Kim
patent: 5998860 (1999-12-01), Chan et al.
patent: 6137162 (2000-10-01), Park et al.
patent: 6153923 (2000-11-01), Kazama
patent: 6222259 (2001-04-01), Park et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6265771 (2001-07-01), Ference et al.
patent: 6303981 (2001-10-01), Moden
patent: 6326696 (2001-12-01), Horton et al.
patent: 6380615 (2002-04-01), Park et al.
patent: 6414385 (2002-07-01), Huang et al.
patent: 20010026013 (2001-10-01), Mess et al.
patent: 20020008309 (2002-01-01), Akiyama
patent: 20020121687 (2002-09-01), Winderf
patent: 06112461 (1994-04-01), None
Ha Nathan W.
Hynix / Semiconductor Inc.
Pham Long
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