System and method for detecting location of a defective...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S750010

Reexamination Certificate

active

06842021

ABSTRACT:
A method and system for detecting the location of a defect within an integrated circuit (IC). With power applied to the IC via its power supply terminals (VDD, VSS), an infrared (IR) laser light is scanned along the X and Y dimensions of a surface of the IC. Reflected IR light and the IC power supply current are measured and processed using Fourier Transformation computations. Based upon the results of such computations, the Z coordinate is determined that corresponds to the depth of the defect within the IC.

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patent: 6657447 (2003-12-01), Parandoosh
Edward Cole Jr. et al.. Resistive Interconnection Localization, 27th Annual International Symposium for Testing and Failure Analysis, Nov. 11-15, 2001, Santa Clara, California.

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