Polishing member and method of manufacturing semiconductor...

Details Polishing member and method of manufacturing semiconductor... Polishing member and method of manufacturing semiconductor...

2005-04-05

2005-04-05

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S526000

Reexamination Certificate

active

06875088

ABSTRACT:
There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member.

REFERENCES:
patent: 6364744 (2002-04-01), Merchant et al.
patent: 6383065 (2002-05-01), Grumbine et al.
patent: 6435947 (2002-08-01), Mueller et al.
patent: 2001-308041 (2001-11-01), None
Matsui, Y. et al., “Chemical Mechanical Polishing Slurry Containing Abrasive Particles Exhibiting Photocatalytic Function”, U.S. Appl. No. 10/201,488, filed Jul. 24, 2002.

Affiliated with

Also associated with

Rating

Polishing member and method of manufacturing semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing member and method of manufacturing semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing member and method of manufacturing semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3398774