Electronic interface structures and methods

Details Electronic interface structures and methods Electronic interface structures and methods

2005-03-08

2005-03-08

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S735000, C257S736000, C257S737000

Reexamination Certificate

active

06864575

ABSTRACT:
Electronic component, in particular a chip, which can be electrically bonded by means of a plurality of contacts provided on the component to mating contacts provided on a carrier, each contact having a raised elastic base of a conductive material which is connected to a lead on the component side, and to which there is applied on the upper side a metallic cap-like contact covering, only partially covering the base.

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