Electronic device packaging

Details Electronic device packaging Electronic device packaging

2005-01-04

2005-01-04

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S740000, C361S759000, C206S308000, C206S310000

Reexamination Certificate

active

06839239

ABSTRACT:
The present invention discloses a large form factor media enclosure structure configured to removably retain a smaller form factor device therein. The large form factor media enclosure structure includes a first flexible retainer, and a second retainer oppositely disposed from said first retainer. A catch paw is disposed along the first retainer, for frictionally engaging the smaller form factor device.

REFERENCES:
patent: 4793479 (1988-12-01), Otsuka et al.
patent: 5207717 (1993-05-01), Manning
patent: 5363956 (1994-11-01), Taniyama
patent: 5400902 (1995-03-01), Kaminski
patent: 5857573 (1999-01-01), Pakeriasamy
patent: 6237763 (2001-05-01), Lau
patent: 6320759 (2001-11-01), Tusan et al.
patent: 6604635 (2003-08-01), Kutaragi et al.

Affiliated with

Also associated with

Rating

Electronic device packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3397976