Molded flip chip package

Details Molded flip chip package Molded flip chip package

2005-01-04

2005-01-04

Thai, Luan (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S125000, C438S126000, C438S127000

Reexamination Certificate

active

06838313

ABSTRACT:
A method for producing a molded flip chip package is described. According to one embodiment, an incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold, and a resin is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate, and the resin is cured by maintaining the mold at an elevated temperature for a predetermined amount of time.

REFERENCES:
patent: 5450283 (1995-09-01), Lin et al.
patent: 5784261 (1998-07-01), Pedder
patent: 5895229 (1999-04-01), Carney et al.
patent: 5981312 (1999-11-01), Farquhar et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5998243 (1999-12-01), Odashima et al.
patent: 6038136 (2000-03-01), Weber
patent: 6048483 (2000-04-01), Miyajima
patent: 6049122 (2000-04-01), Yoneda
patent: 6071755 (2000-06-01), Baba et al.
patent: 6081997 (2000-07-01), Chia et al.
patent: 6187243 (2001-02-01), Miyajima
patent: 6321734 (2001-11-01), Kaminaga et al.
patent: 6344162 (2002-02-01), Miyajima
patent: 6373125 (2002-04-01), Pannaccione et al.
patent: 0971401 (2000-01-01), None
patent: 2297652 (1996-07-01), None
patent: 59-208756 (1984-11-01), None
patent: 11-195742 (1999-07-01), None
patent: P2000-150760 (2000-05-01), None
PCT Search Report, PCT/US02/17882, Oct. 22, 2002.

Affiliated with

Also associated with

Rating

Molded flip chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molded flip chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded flip chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3397939