Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-09-13
2005-09-13
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C438S601000, C438S613000
Reexamination Certificate
active
06943059
ABSTRACT:
A semiconductor chip (15) having a pad (5) covered with a passivation film (7) is prepared, and the passivation film (7) over the pad (5) is selectively removed to expose the pad (5). Next, a polyimide film (11) having an opening (12) for exposing the pad (5) is formed on the passivation film (7). Thereafter, solder bumps (14) are formed on the pad (5), and an underfill resin (17) is filled between an assembly substrate (16) and the semiconductor chip (15) to bond the assembly substrate (16) and semiconductor chip (15) with the solder bumps (14) interposed therebetween.
REFERENCES:
patent: 6028011 (2000-02-01), Takase et al.
patent: 6707162 (2004-03-01), Ho et al.
patent: 2003/0096494 (2003-05-01), Sakuyama et al.
patent: 2000-357743 (2000-12-01), None
patent: 2002-203866 (2002-07-01), None
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Renesas Technology Corp.
Smoot Stephen W.
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