Flip chip mounting method of forming a solder bump on a chip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S118000, C438S601000, C438S613000

Reexamination Certificate

active

06943059

ABSTRACT:
A semiconductor chip (15) having a pad (5) covered with a passivation film (7) is prepared, and the passivation film (7) over the pad (5) is selectively removed to expose the pad (5). Next, a polyimide film (11) having an opening (12) for exposing the pad (5) is formed on the passivation film (7). Thereafter, solder bumps (14) are formed on the pad (5), and an underfill resin (17) is filled between an assembly substrate (16) and the semiconductor chip (15) to bond the assembly substrate (16) and semiconductor chip (15) with the solder bumps (14) interposed therebetween.

REFERENCES:
patent: 6028011 (2000-02-01), Takase et al.
patent: 6707162 (2004-03-01), Ho et al.
patent: 2003/0096494 (2003-05-01), Sakuyama et al.
patent: 2000-357743 (2000-12-01), None
patent: 2002-203866 (2002-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Flip chip mounting method of forming a solder bump on a chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip mounting method of forming a solder bump on a chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip mounting method of forming a solder bump on a chip... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3397820

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.