Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-03-22
2005-03-22
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S603230, C029S603250, C029S603120, C029S603150, C029S603140, C029S603180, C360S122000, C360S123090, C216S022000
Reexamination Certificate
active
06868600
ABSTRACT:
A method of manufacturing a thin film magnetic head having superior overwrite characteristics as well as an extremely small pole width is disclosed. The thin film magnetic head has a thin film coil provided in a recess region of a bottom pole. This makes it possible to appropriately ensure a thickness of the thin film coil, as well as to reduce a thickness of a second pole tip portion, and therefore it is possible to ensure superior overwrite characteristics, as well as to form the second pole tip portion having an extremely small uniform width. The method of manufacturing a thin film magnetic head forms a recess region in a second magnetic layer close to a first magnetic layer, and forms a first thin film coil for constituting a part of the thin film coil in the recess region.
REFERENCES:
patent: 5075956 (1991-12-01), Das
patent: 5966800 (1999-10-01), Huai et al.
patent: 6-131610 (1994-05-01), None
patent: A-08-147625 (1996-06-01), None
patent: A-10-269524 (1998-10-01), None
patent: A-2000-182212 (2000-06-01), None
Well et al, “Magnetic Domains in Thin-Film Recording Heads as Observed in the SEM by a Lock-In Technique”, IEEE Transactions on Magnetics, No. 3, May 1981, pp. 1253-1261.
TDK Corporation
Tugbang A. Dexter
LandOfFree
Method of manufacturing a thin film magnetic head does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a thin film magnetic head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a thin film magnetic head will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3397346