Method of manufacturing a housing for electronic parts

Details Method of manufacturing a housing for electronic parts Method of manufacturing a housing for electronic parts

2005-05-24

2005-05-24

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S825000, C029S858000, C333S001100

Reexamination Certificate

active

06895665

ABSTRACT:
A method of manufacturing a housing for electronic parts, such as isolators, or the like, with as small non-plated portions as possible, which housing is obtained by separating a housing part from a metallic housing part support with the housing part connected to a frame through connections, the method comprising the steps of cutting off and removing the connections after provisional connections of a resin are formed on the housing part support to connect the frame to the housing part, and obtaining the housing for electronic parts by removing the provisional connections after plating is applied to surfaces of the housing part including cut portions of the connections.

REFERENCES:
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patent: 6037844 (2000-03-01), Makino et al.
patent: 6215371 (2001-04-01), Kurahashi et al.
patent: 6469588 (2002-10-01), Makino et al.
patent: 6625869 (2003-09-01), Jodo
patent: 20030226255 (2003-12-01), Sakai
patent: 7-273506 (1995-10-01), None
patent: 2002-076713 (2002-03-01), None

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