Sequential build circuit board

Details Sequential build circuit board Sequential build circuit board

2005-09-20

2005-09-20

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S830000, C029S825000, C430S315000, C174S262000, C174S263000, C361S792000, C257S698000, C257S700000

Reexamination Certificate

active

06944945

ABSTRACT:
A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

REFERENCES:
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4902610 (1990-02-01), Shipley
patent: 6181569 (2001-01-01), Chakravorty
patent: 6376053 (2002-04-01), Nakamura et al.
patent: 6378201 (2002-04-01), Tsukada et al.
patent: 6506979 (2003-01-01), Shelnut et al.
patent: 6582581 (2003-06-01), Goldberg et al.
patent: 6759596 (2004-07-01), Shelnut et al.

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