Light-receiving module having a light-receiving device on a...

Details Light-receiving module having a light-receiving device on a... Light-receiving module having a light-receiving device on a...

2005-09-27

2005-09-27

Porta, David (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C327S514000

Reexamination Certificate

active

06949731

ABSTRACT:
The present invention provides a light-receiving module that realized a reliable wire bonding from a light-receiving device to a die-capacitor on which the light-receiving device is mounted with adhesive. The light-receiving module of the present invention includes a stem and a die-capacitor disposed on the set. The upper electrode of the die-capacitor has a mounting area where the light-receiving device is mounted, a bonding area to which the bonding-wire is to be bonded, and a structure for interrupting the adhesive from spreading from the mounting area to the bonding area. Since the adhesive for die-bonding the light-receiving device in the mounting area does not spread to the bonding area, the wire-bonding to the bonding area can be reliably performed.

REFERENCES:
patent: 5652425 (1997-07-01), Sawada et al.
patent: 6847665 (2005-01-01), Yamada et al.
patent: 6900512 (2005-05-01), Kohmoto et al.
patent: 2003/0183834 (2003-10-01), Kohmoto et al.
patent: 2004/0008953 (2004-01-01), Ito et al.
patent: 6-302631 (1994-10-01), None
U.S. Appl. No. 10/373,186, filed Feb. 20, 2003, Kohmoto et al.
U.S. Appl. No. 10/397,839, filed Mar. 27, 2002, Kohmoto et al.

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