Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-09-13
2005-09-13
Gurley, Lynne A. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S108000, C438S110000, C438S113000, C438S114000, C438S118000, C438S119000, C438S455000, C438S458000, C438S460000, C438S464000, C438S465000, C438S598000, C438S599000, C438S620000, C438S667000
Reexamination Certificate
active
06943056
ABSTRACT:
A method of manufacturing semiconductor devices includes the following steps. That is, a support board is adhered to a rear surface of a substrate proper which has a plurality of circuit element parts with prescribed functions formed on a circuit forming plane on an obverse surface thereof. First groove portions are formed in the substrate proper. An insulating film (17) is formed on a surface of a semiconductor substrate (50) by using an insulating material, and holes are formed in the first groove portions. Metal wiring patterns (8) are formed which extend from electrode portions to at least parts of inner walls of the holes. A prescribed amount of the support board at a bottom of each of the holes is removed. A conductive material is filled into the holes thereby to form penetration electrodes (10). A second groove portions are formed in the first groove portions.
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Gurley Lynne A.
Renesas Technology Corp.
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