Electronic assembly having a more dense arrangement of...

Details Electronic assembly having a more dense arrangement of... Electronic assembly having a more dense arrangement of...

2005-04-26

2005-04-26

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S734000, C257S737000, C257S691000, C257S774000, C257S773000, C257S778000, C257S698000, C174S260000

Reexamination Certificate

active

06885102

ABSTRACT:
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still allows for routing of traces between the contacts.

REFERENCES:
patent: 5512765 (1996-04-01), Gaverick
patent: 5691569 (1997-11-01), Palmer
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5784262 (1998-07-01), Sherman
patent: 6064113 (2000-05-01), Kirkman
patent: 6376769 (2002-04-01), Chung
patent: 6417463 (2002-07-01), Cornelius et al.
patent: 20010035576 (2001-11-01), Wachtler et al.
patent: 20020060318 (2002-05-01), Katz
patent: 20030170444 (2003-09-01), Stewart et al.
patent: 20030021122 (2003-10-01), Hsu et al.

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