Method for producing channels and cavities in semiconductor...

Details Method for producing channels and cavities in semiconductor... Method for producing channels and cavities in semiconductor...

2005-09-27

2005-09-27

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S116000, C438S048000, C438S064000, C438S049000, C438S050000, C257S415000, C257S433000, C257SE33056

Reexamination Certificate

active

06949405

ABSTRACT:
An electronic component is produced by incorporating a sacrificial part in a plastic housing shape. After molding, the sacrificial part is etched out or otherwise removed from the completed plastic housing. As a result, channels and/or cavities can be formed in the plastic housing in order to allow access to sensor areas on the semiconductor chip.

REFERENCES:
patent: 5424249 (1995-06-01), Ishibashi
patent: 6049120 (2000-04-01), Otani et al.
patent: 2003/0141561 (2003-07-01), Fischer et al.
patent: 42 19 575 (1993-07-01), None
patent: 197 26 839 (1998-07-01), None
patent: 199 29 025 (2000-12-01), None

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