Methods for cleaning silicon wafers with an aqueous solution of

Details Methods for cleaning silicon wafers with an aqueous solution of Methods for cleaning silicon wafers with an aqueous solution of

1995-09-20

1997-02-11

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, B08B 304, B08B 308

Patent

active

056016565

ABSTRACT:
Methods are disclosed for cleaning silicon wafers with an aqueous solution of hydrofluoric acid and hydriodic acid. The methods involve cleaning a silicon wafer in an aqueous solution of hydrofluoric acid and hydriodic acid to prevent the deposition of copper contaminants within the solution from being deposited onto the surfaces of the silicon wafer while minimizing oxidation of the surfaces of the silicon wafer. The aqueous solution of hydrofluoric acid and hydriodic acid preferably has sufficient hydriodic acid to cause no dissociation of the hydrofluoric acid.

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J. H. Eisenbeerg et al., Effect of Hot Water Exposure On Bare Silicon Surfaces in MOS Processing, pp. 485-490; Mat. Res. Soc. Symp, Proc; vol. 315 (1993).
L. Li, G. Zou, H. Bender, P. W. Mertens, M. Meuris, H. F. Schmidt and M. M. Heyns; Proceedings of the Second International Symposium on Ultra-Clean Processing of Silicon Surfacaes,; pp. 167-170; (Sep. 17, 1994).
Hitoshi Morinaga, Makoto Suyama, Masashi Nose, Steven Verraverbeke and Tadahiro Ohmi, Metallic Particle Growth on Si Wafer Surfaces in Wet Chemical Processing and Its Prevention, 1994 Proceedings-- Institute of Environmental Sciences, pp. 332-337.
Tae-Hoon Park, Yong-Sun Ko, Tae-Earn Shim, Jong-Gil Lee, and Young-Kwan Kim, The Cleaning Effects of HF--HNO.sub.3 --H.sub.2 O.sub.2 System, J. Electrochem. Soc., vol. 142, No. 2, Feb. 1995, pp. 571-576.

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