POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, PROCESSES FOR...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

Reexamination Certificate

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C528S183000, C528S184000, C528S272000, C528S332000, C528S347000, C528S348000, C528S363000, C528S364000, C528S367000, C528S373000, C525S420000, C525S434000

Reexamination Certificate

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06900284

ABSTRACT:
Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

REFERENCES:
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patent: 5883221 (1999-03-01), Sezi et al.
patent: 6120970 (2000-09-01), Sezi et al.
patent: 6121495 (2000-09-01), Babb et al.
patent: 6153350 (2000-11-01), Sezi et al.
patent: 6291635 (2001-09-01), Maeda et al.
patent: 6384182 (2002-05-01), Maeda et al.
patent: 100 11 608 (2001-10-01), None
patent: WO 97/10193 (1997-03-01), None

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