Method of fabricating a semiconductor device

Details Method of fabricating a semiconductor device Method of fabricating a semiconductor device

2005-05-10

2005-05-10

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

C451S041000, C451S054000

Reexamination Certificate

active

06890242

ABSTRACT:
Techniques for recycling waste particles may include solidifying particles, which were generated by machining a crystal ingot into a wafer or by machining a semiconductor wafer, into a cake, and melting the cake, for example, into an ingot.

REFERENCES:
patent: 5102594 (1992-04-01), Burlet et al.
patent: 5240656 (1993-08-01), Scheeres
patent: 5755614 (1998-05-01), Adams et al.
patent: 5772900 (1998-06-01), Yorita et al.
patent: 6114401 (2000-09-01), Doonan
patent: 6299513 (2001-10-01), Tsuihiji et al.
patent: 11-19672 (1999-01-01), None
Patent Abstracts of Japan; 11-019672; Jan. 26, 1999.

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