Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-05-17
2005-05-17
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S840000, C029S852000, C029S879000
Reexamination Certificate
active
06892451
ABSTRACT:
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
REFERENCES:
patent: 4788767 (1988-12-01), Desai et al.
patent: 4988306 (1991-01-01), Hopfer, III et al.
patent: 5014419 (1991-05-01), Cray et al.
patent: 5045975 (1991-09-01), Cray et al.
patent: 5122067 (1992-06-01), Sunne
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5367764 (1994-11-01), DiStefano et al.
patent: 5384955 (1995-01-01), Booth et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5570504 (1996-11-01), DiStefano et al.
patent: 5599193 (1997-02-01), Crotzer
patent: 5650919 (1997-07-01), Loh et al.
patent: 5720630 (1998-02-01), Richmond et al.
patent: 5806181 (1998-09-01), Khandros et al.
patent: 5886590 (1999-03-01), Quan et al.
patent: 5899757 (1999-05-01), Neidich et al.
patent: 5926951 (1999-07-01), Khandros et al.
patent: 5939783 (1999-08-01), Laine et al.
patent: 5940278 (1999-08-01), Schumacher
patent: 5953816 (1999-09-01), Pai et al.
patent: 5969953 (1999-10-01), Purdom et al.
patent: 6036502 (2000-03-01), Neidich et al.
patent: 6279227 (2001-08-01), Khandros et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6634100 (2003-10-01), Akram et al.
IBM Technical Disclosure Bulletin, Jan., 1993, “Button Contacts for Probe Card Applications”, pp. 186-187.
IBM Technical Disclosure Bulletin, Mar., 1991, “Pluggable/Removable Cube of Chips Packaging Method”, pp. -460.
Brodsky William Louis
Chan Benson
Gaynes Michael Anthony
Markovich Voya Rista
Arbes Carl J.
Driggs Lucas Brubaker & Hogg Co. LPA
Lucas James A.
LandOfFree
Method of making an interposer sub-assembly in a printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making an interposer sub-assembly in a printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making an interposer sub-assembly in a printed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3385914