Variable cross-section plated mushroom with stud for bumping

Details Variable cross-section plated mushroom with stud for bumping Variable cross-section plated mushroom with stud for bumping

2005-09-06

2005-09-06

Zarneke, David (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000, C257S780000, C257S781000, C257S778000, C257S738000, C257S723000

Reexamination Certificate

active

06940167

ABSTRACT:
An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.

REFERENCES:
patent: 4742023 (1988-05-01), Hasegawa
patent: 5523920 (1996-06-01), Machuga et al.
patent: 6194667 (2001-02-01), Jimarez et al.
patent: 6268114 (2001-07-01), Wen et al.
patent: 6348401 (2002-02-01), Chen et al.
patent: 6372622 (2002-04-01), Tan et al.
patent: 6555908 (2003-04-01), Eichelberger et al.
patent: 6649507 (2003-11-01), Chen et al.
patent: 2001358165 (2001-12-01), None

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