Heat sink assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165185, 174 163, 257719, 257727, H05K 720

Patent

active

053433629

ABSTRACT:
A heat sink assembly 10 having a component clip 24 for mounting an electronic component 12. The heat sink body 16 includes a planar mounting surface 26 providing flexible positioning for the component 12. The heat sink body 16 is affixed to the circuit board 14 by a mounting rail 20 providing flexible positioning of the heat sink body 16 on the circuit board 14.

REFERENCES:
patent: 4193444 (1980-03-01), Boyd et al.
patent: 4739452 (1988-04-01), Fukunaga
patent: 5172756 (1992-12-01), Jayamanne et al.
patent: 5184281 (1993-02-01), Samarov et al.
patent: 5191512 (1993-03-01), Osura et al.
patent: 5272599 (1993-12-01), Koenen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat sink assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat sink assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-33852

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.