Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-07-05
2005-07-05
Paumen, Gary (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S083000
Reexamination Certificate
active
06913468
ABSTRACT:
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.
REFERENCES:
patent: 3290636 (1966-12-01), Overtveld
patent: 3509270 (1970-04-01), Dube et al.
patent: 3616532 (1971-11-01), Beck
patent: 3842189 (1974-10-01), Southgate
patent: 3982159 (1976-09-01), Dennis et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4105277 (1978-08-01), Jacobs
patent: 4138604 (1979-02-01), Harmsen et al.
patent: 4330163 (1982-05-01), Aikens et al.
patent: 4397086 (1983-08-01), Bickos et al.
patent: 4402562 (1983-09-01), Sado
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4480888 (1984-11-01), Hopkins et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4634199 (1987-01-01), Anhalt et al.
patent: 4667219 (1987-05-01), Lee et al.
patent: 4678250 (1987-07-01), Romine et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4761140 (1988-08-01), Geib
patent: 4764848 (1988-08-01), Simpson
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4860433 (1989-08-01), Miura
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4906194 (1990-03-01), Grabbe
patent: 5045975 (1991-09-01), Cray et al.
patent: 5055777 (1991-10-01), Bonelli et al.
patent: 5067007 (1991-11-01), Otsuka et al.
patent: 5088929 (1992-02-01), Enomoto
patent: 5098305 (1992-03-01), Krajewski et al.
patent: 5106309 (1992-04-01), Matsuoka et al.
patent: 5109596 (1992-05-01), Driller et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5195237 (1993-03-01), Cray et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5230632 (1993-07-01), Baumberger et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5317479 (1994-05-01), Pai et al.
patent: 5366380 (1994-11-01), Reymond
patent: 5371654 (1994-12-01), Beaman et al.
patent: 5378160 (1995-01-01), Yumibe et al.
patent: 5386341 (1995-01-01), Olson et al.
patent: 5399982 (1995-03-01), Driller et al.
patent: 5418471 (1995-05-01), Kardos
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5462440 (1995-10-01), Rothenberger
patent: 5466161 (1995-11-01), Yumibe et al.
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5475317 (1995-12-01), Smith
patent: 5476211 (1995-12-01), Khandros
patent: 5500605 (1996-03-01), Chang
patent: 5531022 (1996-07-01), Beaman et al.
patent: 5561594 (1996-10-01), Wakefield
patent: 5573435 (1996-11-01), Grabbe et al.
patent: 5578870 (1996-11-01), Farnsworth et al.
patent: 5593322 (1997-01-01), Swamy et al.
patent: 5611696 (1997-03-01), Donner et al.
patent: 5648893 (1997-07-01), Loo et al.
patent: 5653598 (1997-08-01), Grabbe
patent: 5669774 (1997-09-01), Grabbe
patent: 5677566 (1997-10-01), King et al.
patent: 5686842 (1997-11-01), Lee
patent: 5713744 (1998-02-01), Laub
patent: 5714803 (1998-02-01), Queyssac
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6033935 (2000-03-01), Dozier, II et al.
patent: 6110823 (2000-08-01), Eldridge et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6232149 (2001-05-01), Dozier, II et al.
patent: 6336269 (2002-01-01), Eldridge et al.
patent: 6534856 (2003-03-01), Dozier, II et al.
patent: 6551112 (2003-04-01), Li et al.
patent: 6644985 (2003-11-01), Wilson et al.
patent: 6663399 (2003-12-01), Ali et al.
patent: 6669489 (2003-12-01), Dozier, II et al.
patent: 6695624 (2004-02-01), Szu
patent: 6702594 (2004-03-01), Lee et al.
patent: 6712626 (2004-03-01), Harper et al.
patent: 6731516 (2004-05-01), Ma
patent: 6814587 (2004-11-01), Ma
patent: 2002/0004320 (2002-01-01), Pedersen et al.
patent: 2003/0067080 (2003-04-01), Dozier, II et al.
patent: 2004/0064941 (2004-04-01), Dozier, II et al.
patent: 2004/0152348 (2004-08-01), Pedersen et al.
patent: 145327 (1985-06-01), None
patent: 2643753 (1989-02-01), None
patent: 2680284 (1993-02-01), None
patent: 54-146581 (1979-11-01), None
patent: 58178293 (1983-11-01), None
patent: 60-49656 (1985-03-01), None
patent: 61-211977 (1986-09-01), None
patent: 6244285 (1987-03-01), None
patent: 6363777 (1988-04-01), None
patent: 63-187653 (1988-08-01), None
patent: 63243768 (1988-10-01), None
patent: 1-289147 (1989-11-01), None
patent: 2034949 (1990-02-01), None
patent: 2144869 (1990-06-01), None
patent: 5-175376 (1993-07-01), None
“Bimetal VLSI Chip Interconnections,” IBM Technical Disclosure Bulletin, vol. 29. No. 11, pp. 5021-5022 (Apr. 1987).
“Cooling System for Semiconductor Modules,” IBM Technical Disclosure Bulletin, vol. 26, No. 3B, p. 1548 (Aug. 1983).
“Interposer for Direct Chip Attach or Surface Mount Array Devices,” IBM Technical Disclosure Bulletin, vol. 36, No. 7, p. 137 (Jul. 1993).
Falda, “Pluggable Stacked Module,” IBM Technical Disclosure Bulletin, vol. 23 No. 12 (May 1981).
Jarvela, “Module Holder And Actuator,” IBM Technical Disclosure Bulletin, vol. 16, No. 1, pp. 3975-3976, May 1974.
Dozier, II Thomas H.
Eldridge Benjamin N.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Burraston N. Kenneth
FormFactor Inc.
Paumen Gary
LandOfFree
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