Ceramic joint body

Details Ceramic joint body Ceramic joint body

2005-07-26

2005-07-26

Lam, Cathy F. (Department: 1775)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S544000

Reexamination Certificate

active

06921881

ABSTRACT:
A ceramic joint body including a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for use for a semiconductor product producing/examining the step. The ceramic bonded body includes a ceramic substrate in which a conductor is provided, and a ceramic body bonded to a bottom face of the ceramic substrate. The ceramic bonded body has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body.

REFERENCES:
patent: 5207437 (1993-05-01), Barnes et al.
patent: 5800618 (1998-09-01), Niori et al.
patent: 5879766 (1999-03-01), Kato
patent: 6063328 (2000-05-01), Kato
patent: 6376808 (2002-04-01), Tachikawa et al.
patent: 6465763 (2002-10-01), Ito et al.
patent: 6475606 (2002-11-01), Niwa
patent: 6507006 (2003-01-01), Hiramatsu et al.
patent: 6677557 (2004-01-01), Ito et al.
patent: 2002/0043527 (2002-04-01), Ito
patent: 2002/0043530 (2002-04-01), Ito
patent: 2002/0055021 (2002-05-01), Niwa
patent: 2003/0015521 (2003-01-01), Ito
patent: 0699643 (1996-03-01), None
patent: 0836221 (1998-04-01), None
patent: 1109423 (2001-06-01), None
patent: 4-324276 (1992-11-01), None
patent: 2783980 (1998-05-01), None
patent: 10-242252 (1998-09-01), None
patent: 2000-114355 (2000-04-01), None
patent: 01/47831 (2001-07-01), None

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