Heat pipe type heat dissipation device

Details Heat pipe type heat dissipation device Heat pipe type heat dissipation device

2005-09-06

2005-09-06

McKinnon, Terrell (Department: 3743)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104210, C165S080400, C165S104260, C361S697000, C361S700000, C257S715000

Reexamination Certificate

active

06938681

ABSTRACT:
A heat dissipation device includes a base (10), a post (20), a plurality of fins (50), a pair of heat pipes (30) and a pair of plates (40). The base is for contacting an electronic component. Each fin defines an aperture (52) therein. When the fins are parallelly stacked upon the base, the apertures cooperatively define a channel. The post is extended perpendicularly from the base and received in the channel. The post defines a pair of through holes (21) along a length direction thereof. The plates are located at opposite peripheries of the stacked fins and parallel to the post. Each plate defines an engaging hole (41) therein. Each heat pipe is substantially inverted U-shaped and includes parallel first and second section (32, 34) respectively soldered into a corresponding through hole of the post and the engaging hole of a corresponding plate.

REFERENCES:
patent: 4204246 (1980-05-01), Arii et al.
patent: 5651414 (1997-07-01), Suzuki et al.
patent: 5924479 (1999-07-01), Egbert
patent: 5925929 (1999-07-01), Kuwahara et al.
patent: 6084772 (2000-07-01), Pell et al.
patent: 6167619 (2001-01-01), Beagle
patent: 6382307 (2002-05-01), Wang et al.
patent: 6404632 (2002-06-01), Forkas
patent: 6435266 (2002-08-01), Wu
patent: 6542364 (2003-04-01), Lai et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 6651733 (2003-11-01), Horng et al.
patent: 6745824 (2004-06-01), Lee et al.
patent: 6749011 (2004-06-01), Horng et al.
patent: 6779595 (2004-08-01), Chiang
patent: 6785140 (2004-08-01), Artman et al.
patent: 2005/0073811 (2005-04-01), Wang et al.

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