Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-03-15
2005-03-15
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C257S675000, C257S787000, C257S788000
Reexamination Certificate
active
06867977
ABSTRACT:
A protective layer and an encapsulant for a thermal interface are disclosed. In one embodiment, an apparatus has a heat generating device, a heat dissipating device, a thermal interface between the heat generating and heat dissipating devices, and an encapsulant covering the thermal interface. In another embodiment, layers of grease are applied between the thermal interface and at least one of the heat generating and heat dissipating devices. In a further embodiment, a method comprises encapsulating a thermal interface in an encapsulant to protect the thermal interface. In another embodiment, a method comprises applying a first layer of grease between a heat generating device and a thermal interface and a second layer of grease between a heat dissipating device and the thermal interface.
REFERENCES:
patent: 5744863 (1998-04-01), Culnane et al.
patent: 6040631 (2000-03-01), Dibble et al.
patent: 6197859 (2001-03-01), Green et al.
patent: 6229204 (2001-05-01), Hembree
patent: 6236568 (2001-05-01), Lai et al.
patent: 6306686 (2001-10-01), Horton et al.
patent: 6601294 (2003-08-01), Jiang et al.
patent: 20030085475 (2003-05-01), Im et al.
Chang Je-Young
DiStefano Eric
Blakely , Sokoloff, Taylor & Zafman LLP
Chervinsky Boris
Intel Corporation
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