Method for manufacturing laminated electronic component

Details Method for manufacturing laminated electronic component Method for manufacturing laminated electronic component

2005-05-10

2005-05-10

Nguyen, Tuyen T. (Department: 2832)

Metal working

Method of mechanical manufacture

Electrical device making

C336S200000, C156S277000

Reexamination Certificate

active

06889423

ABSTRACT:
A laminated electronic component comprising: a plurality of parallel first conductive patterns, which are laminated via a magnetic layer to a plurality of parallel second conductive patterns, the first and second conductive patterns being alternately connected to each other via through-holes, thereby forming a spiral coil inside a laminated body, the axis of the spiral coil being parallel to a mount face; wherein the magnetic layer, provided between the plurality of first conductive patterns and the plurality of second conductive patterns, comprises non-magnetic sections which are provided at positions corresponding to ends of the conductive patterns and extend parallel to the axis of the coil, and a method for manufacturing the same.

REFERENCES:
patent: 5184103 (1993-02-01), Gadreau et al.
patent: 5850682 (1998-12-01), Ushiro
patent: 6133809 (2000-10-01), Tomohiro et al.
patent: 6198374 (2001-03-01), Abel
patent: 6293001 (2001-09-01), Uriu et al.
patent: 6504466 (2003-01-01), Katsurada
patent: 6515568 (2003-02-01), Maki et al.
patent: 6630881 (2003-10-01), Takeuchi et al.
patent: 6692609 (2004-02-01), Kobayashi et al.
patent: 05-190367 (1993-07-01), None
patent: 11-260643 (1999-09-01), None
patent: 20011076929 (2001-03-01), None

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