Dual gauge leadframe

Details Dual gauge leadframe Dual gauge leadframe

2005-07-12

2005-07-12

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000

Reexamination Certificate

active

06917097

ABSTRACT:
A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.

REFERENCES:
patent: 5625235 (1997-04-01), Takiar
patent: 6211462 (2001-04-01), Carter et al.
patent: 6376905 (2002-04-01), Hisano et al.
patent: 6396130 (2002-05-01), Crowley et al.
patent: 6501156 (2002-12-01), Nakanishi et al.

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