Apparatus and method for cooling integrated circuit devices

Details Apparatus and method for cooling integrated circuit devices Apparatus and method for cooling integrated circuit devices

2005-07-12

2005-07-12

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S697000, C361S699000, C257S715000, C174S015200, C165S080400, C165S104260, C165S104330, C062S259400

Reexamination Certificate

active

06917522

ABSTRACT:
Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

REFERENCES:
patent: 4819011 (1989-04-01), Yokota
patent: 5737923 (1998-04-01), Gilley et al.
patent: 6003319 (1999-12-01), Gilley et al.
patent: 6233944 (2001-05-01), Yamada et al.
patent: 2003/0218865 (2003-11-01), Macias

Affiliated with

Also associated with

Rating

Apparatus and method for cooling integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for cooling integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for cooling integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3381195