Flip chip package with warpage control

Details Flip chip package with warpage control Flip chip package with warpage control

2005-09-27

2005-09-27

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S108000, C438S125000

Reexamination Certificate

active

06949404

ABSTRACT:
Provided are a semiconductor flip chip package with warpage control and fabrication methods for such packages. The packages of the present invention include heat spreader lids that are rigidly attached to the die or packaging substrate with a bond that can withstand the considerable bowing pressures caused by the CTE mismatch between the die and substrate. The result is a package with less bowing and so improved co-planarity (in compliance with industry specifications) with the PCB board to which it is ultimately bound. Package reliability is thereby also enhanced, particularly for large die sizes.

REFERENCES:
patent: 5909056 (1999-06-01), Mertol
patent: 6091603 (2000-07-01), Daves et al.
patent: 6103550 (2000-08-01), Camenforte et al.
patent: 6262489 (2001-07-01), Koors et al.
patent: 6472762 (2002-10-01), Kutlu
patent: 6504242 (2003-01-01), Deppisch et al.
patent: 6617683 (2003-09-01), Lebonheur et al.
patent: 6744132 (2004-06-01), Alcoe et al.
patent: 6756685 (2004-06-01), Tao
patent: 6773963 (2004-08-01), Houle
patent: 6784535 (2004-08-01), Chiu
patent: 2004/0016996 (2004-01-01), Tang
patent: 2004/0155358 (2004-08-01), Iijima
patent: 2004/0188862 (2004-09-01), Nagarajan et al.
U.S. Appl. No.: 10/719,451 filed on Nov. 20, 2003 entitled:Structure And Material For Assembling A Low-K Sl Die To Achieve A low Warpage And Industrial Grade Reliability Flip Chip Package With Organic Substrate.
U.S. Appl. No.: 10/849,651 filed May 19, 2004 entitled:Low Stress And Warpage Laminate Flip Chip BGA Package.

Affiliated with

Also associated with

Rating

Flip chip package with warpage control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip package with warpage control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip package with warpage control will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3380979