Integrated circuit device and wiring board

Details Integrated circuit device and wiring board Integrated circuit device and wiring board

2005-05-31

2005-05-31

Paumen, Gary (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

C361S777000

Reexamination Certificate

active

06899544

ABSTRACT:
A semiconductor device has a plurality of first pads to a plurality of fourth pads laid out in a first direction, thereby forming first to fourth pad rows. The first to fourth pad rows are laid out in the named order in a second direction orthogonal to the first direction. First to fourth leads are respectively connected between the first to fourth pad rows and a semiconductor chip. A first slanted side inclined to the first direction is formed at each second pad at that corner which lies on that side of the third pad row. A second slanted side inclined to the second direction in such a way as to face the first slanted side is formed at each third pad. Each first lead has a first slanted portion provided between the first slanted side and the second slanted side and extending in a direction oblique to the first direction.

REFERENCES:
patent: 5946195 (1999-08-01), Hashimoto
patent: 5969461 (1999-10-01), Anderson et al.
patent: 6002592 (1999-12-01), Nakamura et al.
patent: 6566601 (2003-05-01), Maetani
patent: 6753595 (2004-06-01), Lin et al.
patent: 6831234 (2004-12-01), Asai et al.
patent: 2002-196036 (2002-07-01), None

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