Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-05-10
2005-05-10
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S605000, C029S829000, C029S831000, C029S848000, C029S851000, C029S855000, C029S858000, C156S184000, C156S289000, C361S742000, C361S804000, C174S254000, C427S096400
Reexamination Certificate
active
06889426
ABSTRACT:
A method for manufacturing wired circuit board that enables a wired circuit board of high quality to be manufactured without changing in dimension of the wired circuit board substantially. In this method, the wired circuit board is wound in layers in the winding process in such a manner that after an uncured thermosetting resin layer is formed on the wired circuit board in the resin layer forming process, a right-side spacer and a left-side spacer are disposed on the already wound wired circuit board at both widthwise ends thereof and also an upper spacer is disposed on the right-side spacer and the left-side spacer so as to cover a widthwise area of the wired circuit board, so that the right-side spacer, the left-side spacer and the upper spacer are positioned between the layers of the wired circuit board when wound. Thereafter, the wired circuit board wound in the rolled state is heated as it is, to cure the uncured thermosetting resin layer in the curing process.
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“Novel thermally reworkable underfill encapsulants for flip-chip applications”; Wang, L.; Wong, C.P.; Advanced Packaging, IEE Transactions on vol.: 22 , Issue: 1 , Feb. 1999; pp.:46-53.
Fujii Hirofumi
Hayashi Shun-ichi
Dickinson Wright PLLC
Edwards Jean C.
Kim Paul D
Nitto Denko Corporation
Tugbang A. Dexter
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