Semiconductor device and a method of manufacturing the same

Details Semiconductor device and a method of manufacturing the same Semiconductor device and a method of manufacturing the same

2005-05-17

2005-05-17

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S111000, C438S112000, C438S123000, C438S124000, C257S673000

Reexamination Certificate

active

06893898

ABSTRACT:
A semiconductor device comprising a semiconductor chip with plural electrodes arranged on a main surface thereof, plural leads electrically connected respectively to the plural electrodes on the semiconductor chip, and a resin sealing body which seals the semiconductor chip and the plural leads, wherein the plural leads include first leads and second leads adjacent to the first leads, the first leads having first external connections exposed from a mounting surface of the resin sealing body and positioned near a side face of the resin sealing body, the second leads having second external connections exposed from the mounting surface of the resin sealing body and positioned closer to the semiconductor chip with respect to the first external connections. The first and second leads are fixed to the semiconductor chip. The semiconductor device is suitable for a multi-pin structure and the manufacturing yield thereof is improved.

REFERENCES:
patent: 6020649 (2000-02-01), Watanabe et al.
patent: 6410365 (2002-06-01), Kawata et al.
patent: 11-274195 (1999-10-01), None
patent: 11-330343 (1999-11-01), None

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