Micro-machined ultrasonic transducer (MUT) substrate that...

Details Micro-machined ultrasonic transducer (MUT) substrate that... Micro-machined ultrasonic transducer (MUT) substrate that...

2005-01-04

2005-01-04

Williams, Hezron (Department: 2856)

Measuring and testing

Vibration

By mechanical waves

C310S322000, C310S334000, C367S181000, C600S459000

Reexamination Certificate

active

06837110

ABSTRACT:
A micro-machined ultrasonic transducer (MUT) substrate that reduces or eliminates the lateral propagation of acoustic energy includes holes, commonly referred to as vias, formed in the substrate and proximate to a MUT element. The vias in the MUT substrate reduce or eliminate the propagation of acoustic energy traveling laterally in the MUT substrate. The vias can be doped to provide an electrical connection between the MUT element and circuitry present on the surface of an integrated circuit substrate over which the MUT substrate is attached.

REFERENCES:
patent: 6262946 (2001-07-01), Khuri-Yakub et al.
patent: 6430109 (2002-08-01), Khuri-Yakub et al.
patent: 6443901 (2002-09-01), Fraser
patent: 6669644 (2003-12-01), Miller
patent: 20030024317 (2003-02-01), Miller
patent: 20030028106 (2003-02-01), Miller
Cheng et al, An Efficient Electrical Addressing Method Using Through-Wafer Vias for Two-Dimensional Ultrasonic Arrays, 2000, Ultrasonics Symposium, 2000 IEEE, vol. 2, pp. 1179-1182.

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