Method for mounting electronic parts on a board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000, C029S834000, C029S593000, C029S742000, C029S721000, C029S743000

Reexamination Certificate

active

06839960

ABSTRACT:
Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

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patent: 20020046462 (2002-04-01), Inoue et al.
patent: 2001-185899 (2001-07-01), None
patent: 2002-84097 (2002-03-01), None

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