Adhesive polyimide resin and adhesive laminate

Details Adhesive polyimide resin and adhesive laminate Adhesive polyimide resin and adhesive laminate

2005-05-03

2005-05-03

Hightower, P. Hampton (Department: 1711)

Stock material or miscellaneous articles

Composite

Of polyimide

C428S411100, C428S447000, C428S457000, C428S458000, C528S026000, C528S028000, C528S125000, C528S126000, C528S128000, C528S170000, C528S172000, C528S173000, C528S176000, C528S179000, C528S183000, C528S185000, C528S220000, C528S229000, C528S350000, C528S353000, C264S212000, C264S241000, C264S298000, C264S299000, C264S319000, C427S210000, C427S307000, C156S060000

Reexamination Certificate

active

06887580

ABSTRACT:
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

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International Search Report PCT/JP01/00549 mailed on May 1, 2001.
Translation of International Search Report mailed on Aug. 27, 2002.

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