Method, circuit and system for determining burn-in...

Details Method, circuit and system for determining burn-in... Method, circuit and system for determining burn-in...

2005-09-13

2005-09-13

Niebling, John F. (Department: 2812)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

06943575

ABSTRACT:
A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method according to the present invention includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing. The number of failures in each IC die, along with their associated points in time, may be used to create burn-in reliability curves which are conventionally derived using other processes that may be less cost effective or not possible to effect with unpackaged IC dice. Circuits and system associated with the method of the present invention are also disclosed.

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