Miniature electronic device aligner using capacitance techniques

Details Miniature electronic device aligner using capacitance techniques Miniature electronic device aligner using capacitance techniques

1991-04-02

1992-07-14

Wieder, Kenneth A.

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

34087037, 437924, G01R 2726

Patent

active

051306603

ABSTRACT:
A method and structure permit the precision alignment in the packaging of optical components, such as lasers, detectors, lenses and waveguides. The technique involves capacitance measurements of an array of plates placed on the optoelectronic device chip and its package substrate. The technique uses phase sensitive detection to sense the total current capacitively coupled into a passive plate on the device chip from two overlapping plates located on the package substrate. When the device chip is properly aligned with respect to the package substrate, the summed current sensed with a third overlapping plate on the package substrate is a null.

REFERENCES:
patent: 3808527 (1974-04-01), Thomas
patent: 4607213 (1986-08-01), Neukermans et al.
patent: 4654581 (1987-03-01), Neukermans et al.
patent: 4736629 (1988-04-01), Cole

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