Bonding scheme using group VB metallic layer

Details Bonding scheme using group VB metallic layer Bonding scheme using group VB metallic layer

1995-05-10

1997-04-22

Bradley, P. Austin

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228208, 228121, 428662, B23K 3102, B23K 120

Patent

active

056223056

ABSTRACT:
A method for bonding one body to another, such as a laser device to a submount, uses a metallic layer composed of a Group VB metal, such as niobium, sandwiched between a non-metallic layer and solder layer formed by an approximate Au-Sn eutectic layer. Advantageously the Group VB layer is formed at a submount temperature of less than approximately 201.degree. C., advantageously less than approximately 125.degree. C., and preferably less than approximately 101.degree. C.--advantageously to a thickness in the approximate range 0.05 .mu.m to 0.2 .mu.m, or even thinner if pinholes do not develop. The non-metallic layer is located on one of the bodies, and the other body has a metallic coating advantageously capped with an Au layer.

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J.J. Cuomo and J.P. Gilvey, "Method of Bonding to Diamond Surface," IBM Tech. Discl. Bull., vol. 12, No. 4, Sep. 1960, p. 570.
H.S. Chen et al., "Simple Nb Bonding Structure," Appl. Phys. Lett, 66(17), Apr. 24, 1996, pp. 2191-2193.

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