Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2005-01-25
2005-01-25
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S053000, C438S456000
Reexamination Certificate
active
06846724
ABSTRACT:
A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.
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Harris Richard D.
Kretschmann Robert J.
Quarles & Brady LLP
Rockwell Automation Technologies Inc.
Speroff R. Scott
Trinh Michael
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