Integrated circuit self-testing device and method

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – Frequency of cyclic current or voltage

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324158P, 324158R, 437 8, G01R 100, G01R 102

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active

051306441

ABSTRACT:
A semiconductor wafer (26) may have all the integrated circuits (36) formed thereon simultaneously self-tested by the addition of a power circuit, a ground circuit and clock circuit. Lead lines are formed during metallization of the integrated circuits (36) on the wafer (26). The lead lines are interconnected to the integrated circuits (36) to form a power input, a ground input and a clock input on each integrated circuit (36). A test head (28) having a power probe (44), a ground probe (46) and clock probe (48) is attached to the power, ground and clock circuits on the semiconductor wafer (36). The integrated circuits (36) are simultaneously tested by the test head (28), and failed circuits are identified by an infrared detector (42).

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