Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-01-11
2005-01-11
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S843000, C029S860000, C228S180100, C228S180210
Reexamination Certificate
active
06839961
ABSTRACT:
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are exposed to bonding conditions effective to bond the balls with their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual solder balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are bonded with the individual associated bond pads.
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Farnworth Warren M.
Wood Alan G.
Micro)n Technology, Inc.
Tugbang A. Dexter
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