Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...
Reexamination Certificate
2005-07-12
2005-07-12
Seidleck, James J. (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Compositions to be polymerized by wave energy wherein said...
C522S152000, C522S164000, C522S173000, C526S262000, C524S439000, C524S506000, C524S516000, C524S850000, C525S282000, C525S205000, C525S322000, C430S311000, C430S320000
Reexamination Certificate
active
06916856
ABSTRACT:
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
REFERENCES:
patent: 4110364 (1978-08-01), Gaku et al.
patent: 4179551 (1979-12-01), Jones et al.
patent: 4193829 (1980-03-01), Kourtides et al.
patent: 4311636 (1982-01-01), Hahn et al.
patent: 4323662 (1982-04-01), Oba et al.
patent: 4336311 (1982-06-01), Lucey
patent: 4369302 (1983-01-01), Ikeguchi et al.
patent: 4370467 (1983-01-01), Gaku et al.
patent: 4485218 (1984-11-01), Bell et al.
patent: 4533975 (1985-08-01), Bill
patent: 4540650 (1985-09-01), Klug et al.
patent: 4564663 (1986-01-01), Martin et al.
patent: 4578328 (1986-03-01), Kray
patent: 4581461 (1986-04-01), Rossi et al.
patent: 4613637 (1986-09-01), Landis et al.
patent: 4621122 (1986-11-01), Guilbert et al.
patent: 4663424 (1987-05-01), Stix et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4720445 (1988-01-01), Brahim et al.
patent: H424 (1988-02-01), Martin et al.
patent: 4740343 (1988-04-01), Gaku et al.
patent: 4740830 (1988-04-01), Ketley
patent: 4743642 (1988-05-01), Yanacek et al.
patent: 4766179 (1988-08-01), De Koning
patent: 4803250 (1989-02-01), Nagasaki et al.
patent: 4806608 (1989-02-01), Klemarczyk
patent: 4826995 (1989-05-01), Alexander et al.
patent: 4826997 (1989-05-01), Kirchhoff
patent: 4847319 (1989-07-01), Bandlish
patent: 4853449 (1989-08-01), Domeier
patent: 4873116 (1989-10-01), Ancker
patent: 4876153 (1989-10-01), Thorfinnson
patent: 4876358 (1989-10-01), Alexander
patent: 4886842 (1989-12-01), Drain et al.
patent: 4904360 (1990-02-01), Wilson, Jr. et al.
patent: 4908088 (1990-03-01), Boyd et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 4980436 (1990-12-01), Saito et al.
patent: 4999136 (1991-03-01), Su et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5017406 (1991-05-01), Lutz
patent: 5137936 (1992-08-01), Akiguchi et al.
patent: 5153248 (1992-10-01), Muse et al.
patent: 5183869 (1993-02-01), Kramer et al.
patent: 5186383 (1993-02-01), Melton et al.
patent: 5189116 (1993-02-01), Boyd et al.
patent: 5206321 (1993-04-01), Hefner, Jr. et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5246784 (1993-09-01), Fuchs et al.
patent: 5252355 (1993-10-01), Ando et al.
patent: 5302661 (1994-04-01), Bastiaansen
patent: 5314513 (1994-05-01), Miller et al.
patent: 5314950 (1994-05-01), Singh et al.
patent: 5328636 (1994-07-01), Maly et al.
patent: 5347258 (1994-09-01), Howard et al.
patent: 5358992 (1994-10-01), Dershem et al.
patent: 5359020 (1994-10-01), Bunner et al.
patent: 5364700 (1994-11-01), Domeier
patent: 5380768 (1995-01-01), Cranston et al.
patent: 5405686 (1995-04-01), Portelli et al.
patent: 5442039 (1995-08-01), Hefner, Jr. et al.
patent: 5447988 (1995-09-01), Dershem et al.
patent: 5470920 (1995-11-01), Camberlin et al.
patent: 5475048 (1995-12-01), Jamison et al.
patent: 5483101 (1996-01-01), Shimoto et al.
patent: 5527592 (1996-06-01), Afzali-Ardakani et al.
patent: 5536970 (1996-07-01), Higashi et al.
patent: 5599611 (1997-02-01), Afzali-Ardakani et al.
patent: 0 028 994 (1981-05-01), None
patent: 0 051 165 (1982-05-01), None
patent: 0 357 110 (1990-03-01), None
patent: 0 475 655 (1992-03-01), None
patent: 62-057420 (1987-03-01), None
patent: 1-152174 (1989-06-01), None
patent: 93/25386 (1993-12-01), None
Romenesko, B.,Ball Grid Array&Flip Chip Technologies: Their Histories&Prospects, vol. 19, No. 1, The International Journal of Microcircuits & Electronic Packaging, (1996).
Smith, Mark A., et al, Bismaleimide/Vinyl Ether Matrix Copolymers, pp. 337-338.
Roderick, William, “Deydration of N-(p-Chloropheynl) phthalamic Acid by Acetic and Trifluoroacetic Anhydrides”, vol. 29, pp. 745-747 (1964).
Cotter, Robert, J., et al, “The Synthesis of N-Substituted Isomaleimides”, pp. 10-15, (1960).
Romenesko, B.,Ball Grid Array&Flip Chip Technologies: Their Histories&Prospects, vol. 19, No. 1, The International Journal of Microcircuits & Electronic Packaging, 1996.
Bard and Brady, “A New Moisture Resistant Liquid Encapsulant”,42nd Electronic Components&Technology Conference, 1018-1022 (1992).
Cotter et al., “The Synthesis of N-Substituted Isomaleimides”, vol. 26, Jan. 1961, 10-15 (1961).
Crivello and Conlon, “Aromatic Bisvinyl Ethers: A New Class of Highly Reactive Thermosetting Monomers”,Journal of Polymer Science, vol. 21, 1785-1799 (1983).
Crivello et al., “Bismaleimide-Bisvinylether Copolymers: A New Class of Thermosetting Resins”,Polymer Bulletin, vol. 13, 409-415 (1985).
Hall, R. J., “Quality Assurance Specifications and Test Methods for Choosing A Solder Mask”,Surface Mount Int'l Conf. And Expo. Proc. Tech. Prog., 939-943 (1993).
Johnson, M., “Why Use a Wet-Dry Solder Mask?”,Printed Circuit Fabrication, vol. 13, no. 10, 74, 76, 78, 80 (1990).
Okamoto et al., “Novel vinyl ether thermosetting resins”,Polymer, vol. 34, no. 4, 691-695 (1993).
Pennisi and Gold, “A New Liquid Encapsulant for IC Packaging”,42nd Electronic Components&Technology Conference, 1015-1017 (1992).
Sauers, C., “The Dehydration of N-Arylmaleamic Acids with Acetic Anhydride”,The Journal of Organic Chemistry, vol. 34, no. 8, Aug. 1969, 2275-2279 (1969).
Stone, D., “Derailing the Cost Drivers”,Printed Circuit Fabrication, vol. 17, no. 12, 16-18 (1994).
Wagener et al., “Donor Acceptor Polymerization Chemistry as a Vehicle to Low Energy Cure of Matrix Resins: Evolution of the 2-Tg Concept to Produce High Tg Polymers at Ambient Temperatures”, Materials Laboratory, Air Force Wright Aeronautical Laboratories, Air Force Systems Command, Wright-Patterson,AFB, Ohio (Mar. 1989).
Dershem Stephen M.
Osuna, Jr. Jose A.
Patterson Dennis B.
Bauman Steven C.
Henkel Corporation
McClendon Sanza L
Seidleck James J.
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